BCM55030SB01
Broadcom Limited
English
Part Number: | BCM55030SB01 |
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Manufacturer/Brand: | Avago Technologies (Broadcom) |
Part of Description: | 10G EPON MDU |
Datasheets: |
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RoHs Status: | ROHS3 Compliant |
ECAD Model: | |
Payment: | PayPal / Credit Card / T/T |
Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
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Product Attribute | Attribute Value |
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Series | * |
Package | Tray |
Product Attribute | Attribute Value |
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Base Product Number | BCM55030 |
17X17 QUAD 5G MACSEC PHY W/ HS C
XFI/USXGMII 2.5G PHY W/HEAT SPRD
BCM55030 + BCM54640
IC TK3715A EPON ONU TFBGA W/FE
IC TXRX PHY 17X17 QUAD 5G MAC HS
BROADCO BGA
10G XPON MDU CHIP
10 G EPON SFU FOR CABLE MARKET
10G XPON DPU CHIP
BROADCOM BGA
55030+3384 BUNDLE
10G XPON BRIDGE CHIP
IC,TK3715A EPON ONU TFBGA W/FEC
BROADCO BGA
1P GPON/10G DPU TO G.FAST 212 B1
1P GPON DPU TO G.FAST 212
BROADCOM BGA
BROADCOM BGA
June 6th, 2024
April 18th, 2024
April 13th, 2024
December 20th, 2023
![]() BCM55030SB01Broadcom Limited |
Quantity*
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Target Price(USD)
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